product

Features

1.High-quality Laser Light Source, High Beam QUality, Small Focusing Spot,More Fine and Clearer.
2.Fast Marking Speed and High Efficiency.
3.Small Heat-affected Area, No Heat Effect, Materials Will Not Be Deformed, Damaged or Burnt.
4.Wide Range of Applicable Materials, Suitable For Materials With Large Heat Radiation Response.
5.No Consumables and Maintenance, Low Energy Consumption and Cost Saving.

Applicable Materials

Fine Marking of Special Materials Is Mainly Used for Marking and Surface Treatment of Various Glass, Lcd Screens, Textiles, Thin Ceramics, Semiconductor Silicon Wafers, IC grains, Sapphire, Polymer Films and Other Materials.

Application Industry

Mainly Used In The High-end Market of Ultra-fine Processing, 3C Industry Marking, Marking of Electronic Components, Electrical Enclosures, Marking of Packaging Bottles For Food, Medicine and Other Polymer Materials; Removal of Metal or Non-Metallic Coatings; Flexible PCB Boards, Dicing; Silicon Wafer Micro-hole and Blind Hole Processing; LCD Liquid Crystal Glass Two-dimensional Code Marking, Glass Surface Hole Drilling, Plastic Keys, Electronic Components, Gifts, Communication Equipment, Building Materials,etc.